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Laser Wafer Cutting System
Product Introduction
The Kleave series is equipped with precision motion control and advanced laser processing technology to perform high-accuracy wafer dicing. Designed for superior cutting quality and process reliability, it prepares wafers for downstream expansion and backend operations. The equipment delivers a versatile and high-efficiency laser cutting solution tailored to the demands of modern semiconductor manufacturing.
  • Product Features
  • Field of application
  • Technical indicators
  • Application Cases
Product Features

Supports wafer sizes of wide range and thicknesses

Suitable for various substrates including sapphire, silicon, silicon carbide, lithium tantalate, and more

High positioning accuracy and repeatability

Excellent cutting quality with high straightness, no chipping or cracks

Minimal damage zone


Field of application
Die-level dicing of Si, SiC, and other wafer substrate materials
Technical indicators
Laser Source DPSS Laser
Wafer Size Support up to 12''
X-axis Travelling Range
Moving Speed
Resolution
Positioning Accuracy 		310 mm
10 ~ 800 mm/s
100 nm
±5 μm
Y-axis Travelling Range
Moving Speed
Resolution
Positioning Accuracy 		310 mm
10 ~ 800 mm/s
100 nm
±5 μm
Z-axis Resolution
Positioning Accuracy 		100 nm
±2 μm
θ-axis Max. Rotating Angle 100 deg.
Application Cases
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