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Panel Level TGV Laser Micro-Drilling System
Product Introduction
This system integrates a high-precision motion platform and advanced control system with an optimized optical architecture. It is specifically designed to meet the dual demands of precision and throughput for through-glass via (TGV) processing on large-format glass substrates.
Product Features

High-precision dynamic tracking platform combined with responsive motion control modules for fast, accurate, and efficient laser modification of glass

Custom-engineered optical path system tailored for multi-material compatibility and stable, repeatable process performance

Multiple vision alignment modes adaptable to fiducial marks, external contours, and other positioning strategies

Proprietary control software developed by DR Laser with bilingual (Chinese/English) interface for enhanced user experience


Field of application
Glass-based chip packaging, display chip encapsulation, etc.
Technical indicators
Specification
Details
Substrate Size
Up to 650 × 650 mm (downward compatible)
Loading Method
Robotic arm / roller feed
Processing Type
Laser + high-precision motion platform
Platform Speed
≤ 1400 mm/s
Hole Shapes
Circular, square, blind via, through via, micro-groove
Minimum Hole Diameter
5 μm
Platform Accuracy
Repeatability ≤ 1.5 μm; Positioning Accuracy ≤ ±3 μm
Pattern Placement Accuracy
≤ ±5 μm @ 600 mm; ≤ ±3 μm @ 300 mm
Throughput
≥ 5000 points per second

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